Product model: TEC1-12706
Logarithmic 127 appearance size 40 X 40 components
Standard
tin lead conductor, PVC insulated skin, 125 plus or minus 2 mm long,
lead wire end skinning 7 plus or minus 1 mm wire welding one end on the
hot surface.
1.95 ~ 2.15 Ω resistance (23 + / - 1 ℃, environment temperature 1 KHZ Ac test)
The largest temperature difference delta Tmax (Qc = 0) 67 ℃
When working current Imax 12 VDC 4.7 A, 6.3 A 15.4 VDC
Vmax maximum voltage 15.4 VDC
Maximum refrigerating power Qcmax 56 w (15.4 VDC)
The assembly pressure of 98 n/cm2
An overview, principle
You
know when the CPU working temperature is lower, the better.Many
articles about CPU heat dissipation is good overclocking is one of the
key success factors.
Generally by using large fans, such as thermal
conductive silicone coating to improve the CPU cooling conditions, but
these methods can make the temperature of the CPU below room
temperature.
Here when it comes to the semiconductor
refrigeration device is based on the characteristics of thermoelectric
technology, the use of special semiconductor thermopile refrigerating,
can convert electrical energy directly to heat, high efficiency.
General
CPU heat power is less than 30W, and the power of the cooler than 50 w,
if heat dissipation is good, it is possible to make the CPU work under
close to 0 ℃ and 0 ℃.
Semiconductor refrigerating unit USES a
lot of, can be used for the production of portable refrigeration/heat
preservation box, hot and cold water dispenser, etc.Also used for
cooling of electronic devices.
The refrigerating unit used by the semiconductor material is the most main is bismuth telluride, joined the impurity content through special processing and into N or P type semiconductor thermoelectric elements.
Common market TEC1-12605, for
example, its rated voltage: 12 v, rated current is 5 a, the maximum
temperature difference of up to 65 degrees Celsius, installation
dimensions for 4 X 4 X 0.4 Cm, weighs about 25 grams.Its characteristics
is as refrigeration and heating.
After connected to a dc
power supply, electronic by the cathode (-), the first after a p-type
semiconductor, in the absorption of heat, the N type semiconductor, heat
rejection, it will every NP module, have heat was sent to the other
side by side, caused by temperature difference, thus forming the hot and
cold end.
Package includes:
1 X TEC1-12706 Heatsink Thermoelectric Cooler Peltier Cooling Plate
Note: all the descriptions and prices are subject to change without prior notice.
Free Shipping: No
Shipping Weight/Unit(g): 25.00
Std. Packing Qty. (pcs): 1
